Corner and Edge Bonding, Die Attachment, Underfilling
Printed Circuit Board (PCB) and Flexible Printed Circuit (FPC) assembly processes are continuously changing to accommodate component modifications that increase speed and decrease package size. These changes have a direct impact on the adhesives used in component attachment. Adhesive manufacturers must constantly be in synch with new technology, and provide products that optimize manufacturing processes and the operating performance of the circuit.
Panacol-USA offers a broad selection of adhesive products to address these challenges. They include light curable acrylics and cationic epoxies, as well as room temperature and thermal curing epoxies. Complete assembly solutions can be developed quickly from this diverse grouping.
Corner and edge bonding of BGA and similar surface mounted components is efficiently accomplished using Panacol-USA’s selection of light curable adhesives. This grouping includes our exclusive LED curable adhesive technology. LED curable products from Panacol-USA fully cure in seconds under low intensity UV or Visible light. They are ideal for pairing with our Honle LED curing equipment. These high strength, flexible adhesives can minimize vibration and thermal interconnect stresses between the circuit board and BGA.
Die attachment and flip-chip underfilling adhesives are also available from Panacol-USA. UV Light/thermal curable acrylates, cationic epoxies, and conductives deliver the properties demanded from these applications. All of our die attachment and underfilling adhesives can be dispensed manually or using automated dispensing systems. They are formulated to meet global regulatory standards, including RohS, REACH, UL, and IPC. These electronic grade adhesives offer high resistance to thermal cycling and are made with low ionic content (less than 10 ppm). The consistent performance of this adhesive selection will reduce flip-chip thermal cycling stresses, ultimately increasing the fatigue life of the entire circuit assembly.
Several Panacol underfill and edge-bonding adhesives are designed for simplified removal when required. For easy identification, the removable adhesives fluoresce yellow under UV light despite their black coloration. These adhesives enhance prosses control, and improve reworkability and recycling opportunities in electronic equipment manufacturing processes.
A red colored adhesive is applied as edge bonding to make a contrast with the green PCB board for enhanced process control
UV curing equipment:
UV system solutions with Panacol uv curable adhesives and innovative curing systems from Honle
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View the adhesive selections listed below for possible candidates for your corner bonding, edge bonding, die attachment, and underfilling applications.
| Adhesive | Application | Viscosity [mPas] | Base | Curing* | Properties |
|---|---|---|---|---|---|
| Vitralit® 2655 | flip chip underfill | 150-300 | epoxy |
UV secondary heat cure |
flexible capillary flow high ion purity |
| Vitralit® 2667 |
flip chip underfill aerospace |
3,000-5,000 (LVT, 25°C, Sp. 4/30 rpm) | epoxy |
UV secondary heat cure |
Low thermal expansion low ion content No outgassing |
| Vitralit® 6104 VT |
encapsulation of electronic components SMD assembly attaching components on PCBs automotive, aerospace |
8,000-17,000 (Rheometer, 25°C, 10s^-1) | acrylate |
UV secondary heat cure |
Very high adhesion to metals and sintered materials ideal for bonding large components on circuit boards (corner bonding) |
| Vitralit® 90070 |
Edge bonding Wire tacking Ruggedizing of PCN mounted components |
10,000-18,000 | acrylate |
UV VIS |
High strength bonds between FR-4 (epoxy boards), polycarbonate, ABS, glass fiber, and metals Clear Highly resistant to moisture |
| Vitralit® UD 2018 | attaching components on PCBs | 11,000-25,000 (Rheometer, 25°C, 10s^-1) | epoxy |
UV secondary heat cure |
Resistant to temperature cycles low shrinkage low thermal expansion coefficient red color pink fluorescent |
| Vitralit® UV 2115 |
lens bonding cement attaching components on PCBs SMD assembly plastic bonding potting material automotive, aerospace |
20,000-30,000 (Rheometer, 25°C, 50s^-1) | acrylate |
UV VIS |
Acrylate hybrid superior strength low thermal expansion low shrinkage impact resistant resistant to soldering stress paste-like stable and high viscous |
| Elecolit® 3063 |
LCD bonding bonding flexible conductors |
12,000-30,000 (Rheometer, 25 °C, 10s^-1); 150,000-190,000 (LVT. 25 °C, Sp.7/5 rpm) | acrylate |
UV + pressure VIS + pressure |
electrically conductive (ACA) |
| Elecolit® 3064 |
LCD bonding bonding flexible conductors |
150,000-190,000 (LVT, 25 °C, Sp. 7/5 rpm); 12,000-30,000 (Rheometer, 25 °C, 10s^-1) | acrylate |
UV + pressure VIS + pressure |
electrically conductive (ACA) |
| Elecolit® 3065 |
bonding flexible circuits display and touchscreen sealing |
25,000-45,000 (Rheometer, 25 °C, 10s-1)) | acrylate |
UV + pressure VIS + pressure thermal postcuring |
Electrically conductive (ACA) Transparent brownish color High flexibility Very high adhesion to PET, Kapton and Mylar |
| Elecolit® 327 | bonding electroconductive parts | paste-like | polyimid | thermal |
electrically conductive (ICA) thermally conductive high temperature resistant up to 275°C |
| Elecolit® 3653 |
bonding electroconductive parts ideal for parts subjected to high vibrations |
4,000-8,000 | epoxy | thermal |
electrically conductive (ICA) thermally conductive |
| Elecolit® 3655 | LED die attach | 5,000-15,000 (Rheometer 10s^-1) | epoxy | thermal |
electrically conductive (ICA) thermally conductive, thixotropic, silver color, low ion content (Na+, K+, Cl- <10ppm) |
| Elecolit® 3656 |
die attach semiconductor LED applications |
50,000-70,000 | epoxy | thermal |
silver-containing small grain size high filling density low ion content |
| Elecolit® 3661 | bonding flexible interconnect devices | 20,000-40,000 | epoxy | thermal |
electrically conductive (ICA) thermally conductive stable flexible |
| Structalit® 5604 |
attaching components on PCBs SMD assembly die attach smart card plastic bonding |
25,000-40,000 (Rheometer, 25 °C, 10s^-1) | epoxy | thermal |
Fast curing red color fixing components on PCBs SMD applications |
| Structalit® 5610 |
attaching components on PCBs SMD assembly |
22,000-40,000 | epoxy | thermal |
very fast curing even at low temperatures high temperature resistance red color |
| Structalit® 5705 |
Edge Bonding, Applications on PCBs |
7,000-12,000 | epoxy |
thermal |
Black color, yellow fluorescent, reworkable above 150°C, jettable, low in halogens, very suitable as edge bonding adhesive |
| Structalit® 8202 |
Electronics Automotive Underfill for chip stack packages Protection of soldered connections |
300-400 (Rheometer, 25°C, 10s^-1) | epoxy | thermal |
Black, fast curing Capillary flow behavior Compatible with flux materials Low CTE, high glass transition temperature Low ion content (Cl- <900ppm) |
*UV = 320 - 390 nm VIS = 405 nm
To download the technical datasheets (TDS) please click on the adhesive name.